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Debonding failure characteristics of multi-laminated bonding system under cryogenic temperature
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2024.11.27 16:57
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20
확장 컬럼
게재년월
2011.6
게재지명
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
학술지색인
SCIE (Science Citation Index Expended)
저자
CS Lee, MS Chun, MH Kim,?JM Lee
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