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Numerical evaluation for debonding failure phenomenon of adhesively bonded joints at cryogenic temperatures
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access_time
2024.11.27 16:57
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25
확장 컬럼
게재년월
2011.11
게재지명
COMPOSITES SCIENCE AND TECHNOLOGY
학술지색인
SCI (Science Citation Index)
저자
CS Lee, MS Chun, MH Kim,?JM Lee
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Numerical Analysis of Hydrogen Transport using a Hydrogen-Enhanced Localized Plasticity Mechanism
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